LOCTITE® ABLESTIK ABP 2036SF

Features and Benefits

LOCTITE ABLESTIK ABP 6892, BMI/Acrylate, Die Attach, Non-conductive Paste
LOCTITE® ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination and overall improvement in package reliability
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Technical Information

Application method Dispense System
Applications Die Attach
Colour Red
Cure type Heat Cure
Filler type Silica
Glass transition temperature (Tg) 125.0 °C
Hot die shear strength, @ 150.0 °C 2 x 2 mm Si die on PPF leadframe 1.6 kg-f
Key characteristics Conductivity: Electrically Non-Conductive, Cure Speed: Fast Cure, Stress: Low Stress
Number of components 1 Part
Physical form Paste
RT die shear strength, 2 x 2 mm Si die on PPF leadframe 12.0 kg-f
Recommended for use with LeadFrame: Gold
Tensile modulus, @ 250.0 °C 55.0 N/mm² (8180.0 psi )
Thermal conductivity 0.35 W/mK
Thixotropic index 4.42
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 12760.0 mPa·s (cP)