LOCTITE ABLESTIK ABP 2032S
Terkenal sebagai ABP 2032S (17G)
fitur dan keuntungan
LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in large die size package applications.
- Good adhesion
- Low temperature cure
- Electrically conductive
- Good dispensing characteristics
Dokumen dan Unduhan
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Informasi Teknis
| Aplikasi | Pelekat Die |
| Kekuatan Geser Die RT | 16.0 kg-f |
| Koefisien Muai Termal (CTE) | 54.0 ppm/°C |
| Konten Ionik yang Dapat Diekstrak, Kalium (K+) | 19.0 ppm |
| Konten Ionik yang Dapat Diekstrak, Klorida (Cl-) | 29.0 ppm |
| Konten Ionik yang Dapat Diekstrak, Natrium (Na+) | 19.0 ppm |
| Modulus Tensil, DMA @ 250.0 °C | 150.0 N/mm² (21755.0 psi ) |
| Substrat | LeadFrame: Emas |
| Tipe Pengeringan | Heat Cure |
LOCTITE ABLESTIK ABP 2032S
LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive