LOCTITE® ABLESTIK ABP 2032S

Known as ABP 2032S (17G)

Features and Benefits

LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in large die size package applications.
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Technical Information

Applications Die Attach
Coefficient of thermal expansion (CTE) 54.0 ppm/°C
Cure type Heat Cure
Extractable ionic content, Chloride (CI-) 29.0 ppm
Extractable ionic content, Potassium (K+) 19.0 ppm
Extractable ionic content, Sodium (Na+) 19.0 ppm
RT die shear strength 16.0 kg-f
Recommended for use with LeadFrame: Gold
Tensile modulus, DMA @ 250.0 °C 150.0 N/mm² (21755.0 psi )