LOCTITE ABLESTIK 84-3J
fitur dan keuntungan
LOCTITE ABLESTIK 84-3J, Epoxy, Die Attach
LOCTITE® ABLESTIK 84-3J adhesive is designed for die attach applications as well as component attach. The use of this material as a staking compound under chip components help eliminate shorting due to the capillary action of conductive adhesives.
Please refer to the TDS for alternate cure schedules.
- Electrically Insulating
- Engineered for accurate bondline control
- One component
- Long work life
Dokumen dan Unduhan
Mencari TDS atau SDS dalam bahasa lain?
Informasi Teknis
Aplikasi | Pelekat Die |
Indeks Tiksotropik | 2.5 |
Kekuatan Geser Die RT | 21.0 kg-f |
Koefisien Muai Termal (CTE) | 41.0 ppm/°C |
Koefisien Muai Termal (CTE), Above Tg | 112.0 ppm/°C |
Konduktivitas Termal | 0.5 W/mK |
Konten Ionik yang Dapat Diekstrak, Kalium (K+) | 20.0 ppm |
Konten Ionik yang Dapat Diekstrak, Klorida (Cl-) | 10.0 ppm |
Konten Ionik yang Dapat Diekstrak, Natrium (Na+) | 5.0 ppm |
Modulus Tensil, @ 250.0 °C | 172.0 N/mm² (25000.0 psi ) |
Suhu Transisi Kaca (Tg) | 87.0 °C |
Tipe Pengeringan | Heat Cure |
Viskositas, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 20000.0 mPa.s (cP) |