LOCTITE ABLESTIK 8008
Terkenal sebagai ABLECOAT 8008
fitur dan keuntungan
LOCTITE ABLESTIK 8008, Proprietary Hybrid Chemistry, Die Attach
LOCTITE ABLESTIK 8008 snap curable adhesive is designed for small die sizes (<3mm). It exhibits moderate electrical and thermal conductivity. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008 should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes.
- Electrically conductive
- Snap curable after B-stage
- Thermally conductive
- Low modulus
Dokumen dan Unduhan
Mencari TDS atau SDS dalam bahasa lain?
Informasi Teknis
| Aplikasi | Pelekat Die |
| Kekuatan Geser Die Panas | 2.6 kg-f |
| Kekuatan Geser Die RT | 6.0 kg-f |
| Koefisien Muai Termal (CTE) | 42.0 ppm/°C |
| Konten Ionik yang Dapat Diekstrak, Klorida (Cl-) | 4.0 ppm |
| Konten Ionik yang Dapat Diekstrak, Natrium (Na+) | 4.0 ppm |
| Modulus Tensil, @ 250.0 °C | 1800.0 N/mm² (261070.0 psi ) |
| Tipe Pengeringan | Heat Cure |
LOCTITE ABLESTIK 8008
LOCTITE ABLESTIK 8008, Proprietary Hybrid Chemistry, Die Attach