LOCTITE® ABLESTIK 8008
Known as ABLECOAT 8008
Features and Benefits
LOCTITE ABLESTIK 8008, Proprietary Hybrid Chemistry, Die Attach
LOCTITE ABLESTIK 8008 snap curable adhesive is designed for small die sizes (<3mm). It exhibits moderate electrical and thermal conductivity. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008 should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 42.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 4.0 ppm |
| Extractable ionic content, Sodium (Na+) | 4.0 ppm |
| Hot die shear strength | 2.6 kg-f |
| RT die shear strength | 6.0 kg-f |
| Tensile modulus, @ 250.0 °C | 1800.0 N/mm² (261070.0 psi ) |
LOCTITE® ABLESTIK 8008
LOCTITE ABLESTIK 8008, Proprietary Hybrid Chemistry, Die Attach