LOCTITE ABLESTIK 2035SC-1B1
Terkenal sebagai ABLEBOND 2035SC-1B1 (14G)
fitur dan keuntungan
LOCTITE ABLESTIK 2035SC-1B1, Acrylate, Die Attach, Non-Conductive Adhesive
LOCTITE® ABLESTIK 2035SC-1B1 non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. It is designed for die attach applications requiring good dielectric layer. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK 2035SC-1B1 adhesive is the 20μm bondline control version of ABLEBOND 2035SC adhesive.
- Non-conductive
- Single component
- Low cure temperature
- Fast cure
Dokumen dan Unduhan
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Informasi Teknis
| Aplikasi | Pelekat Die |
| Formulir Fisik | Pasta |
| Indeks Tiksotropik | 4.3 |
| Kekuatan Geser Die Panas, @ 150.0 °C 1.3 x 1.3 mm Si die on PBGA | 1.11 kg-f |
| Kekuatan Geser Die RT, 1.3 x 1.3 mm Si die on PBGA | 3.81 kg-f |
| Koefisien Muai Termal (CTE) | 54.0 ppm/°C |
| Koefisien Muai Termal (CTE), Above Tg | 128.0 ppm/°C |
| Konduktivitas Termal | 0.35 W/mK |
| Kunci Karakteristik | Kecepatan Kering : Cepat Kering, Konduktivitas: Tidak Konduktif Elektrik, Stres: Stres rendah |
| Metode Aplikasi | Sistem dosis |
| Nomor Komponen | 1 Part |
| Substrat | Laminasi |
| Suhu Transisi Kaca (Tg) | 120.0 °C |
| Teknologi | Acrylate |
| Tipe Pengeringan | Heat Cure |
| Viskositas, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11000.0 mPa.s (cP) |
| Warna | Merah |
LOCTITE ABLESTIK 2035SC-1B1
LOCTITE ABLESTIK 2035SC-1B1, Acrylate, Die Attach, Non-Conductive Adhesive