LOCTITE® ABLESTIK 2035SC-1B1

Known as ABLEBOND 2035SC-1B1 (14G)

Features and Benefits

LOCTITE ABLESTIK 2035SC-1B1, Acrylate, Die Attach, Non-Conductive Adhesive
LOCTITE® ABLESTIK 2035SC-1B1 non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. It is designed for die attach applications requiring good dielectric layer. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK 2035SC-1B1 adhesive is the 20μm bondline control version of ABLEBOND 2035SC adhesive.
Read More

Technical Information

Application method Dispense System
Applications Die Attach
Coefficient of thermal expansion (CTE) 54.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 128.0 ppm/°C
Colour Red
Cure type Heat Cure
Glass transition temperature (Tg) 120.0 °C
Hot die shear strength, @ 150.0 °C 1.3 x 1.3 mm Si die on PBGA 1.11 kg-f
Key characteristics Conductivity: Electrically Non-Conductive, Cure Speed: Fast Cure, Stress: Low Stress
Number of components 1 Part
Physical form Paste
RT die shear strength, 1.3 x 1.3 mm Si die on PBGA 3.81 kg-f
Recommended for use with Laminate
Thermal conductivity 0.35 W/mK
Thixotropic index 4.3
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 11000.0 mPa·s (cP)