LOCTITE® ABLESTIK ABP 6892
Features and Benefits
LOCTITE ABLESTIK ABP 6892, Die Attach
LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination and overall improvement in package reliability.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 111.4 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 190.6 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | -25.0 °C |
| Thixotropic index | 1.75 |
| Viscosity, Brookfield, @ 25.0 °C Speed 0.5 rpm | 4100.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 6892
LOCTITE ABLESTIK ABP 6892, Die Attach