LOCTITE® ABLESTIK 24
Omadused ja eelised
This non-electrically conductive water-clear adhesive is ideal for joining transparent materials. It creates a thin bond line and resilient bonds between materials with mismatched CTEs.
LOCTITE® ABLESTIK 24 is perfect for joining transparent materials, such as glass, and where a thin bond line is desired. It can withstand continuous exposure at temperatures as high as 90°C (194°F) and short-term exposures up to 120°C (248°F), and it forms resilient bonds between materials with mismatched CTEs (coefficient of thermal expansion).
Lugege rohkem
Dokumendid ja allalaadimised
Otsite TDS-i või SDS-i teises keeles?
Tehniline teave
| Segatud | |
| Viskoossus, Segatud | 800.0 mPa.s (cP) |
| Komponentide arv | 2-komponentne |
| Soovitatav kasutada koos | Keraamiline pind, Metall, Polükarbonaat, Polüstüreen: vahtpolüstüreen |
| Tahkumistüüp | Toatemperatuuril (ümbritseva niiskuse toimel) tahkumine |
LOCTITE® ABLESTIK 24
This non-electrically conductive water-clear adhesive is ideal for joining transparent materials. It creates a thin bond line and resilient bonds between materials with mismatched CTEs.