LOCTITE® ABLESTIK ABP 8142B

Features and Benefits

LOCTITE ABLESTIK ABP 8142B3, Silicone, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 8142B3 non-conductive die attach adhesive is designed for MEMs package applications.
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Technical Information

Applications Die attach
Cure type Snap cure
Thixotropic index 3.3
Viscosity, Brookfield CP51, @ 25.0 Speed 5 rpm 12254.0 mPa·s (cP)