LOCTITE® ECCOBOND UF 9000AG
Features and Benefits
LOCTITE® ECCOBOND UF 9000AG is a liquid capillary underfill designed for use with advanced silicon (Si) node flip chips. The highly-filled material has a high Tg, and low CTE that enables excellent bump protection, while providing fast flow and a long work life. High reliability on dies within 20 mm x 20 mm in size, low warpage, and high fracture toughness are also distinguishing characteristics of the advanced underfill.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
LOCTITE® ECCOBOND UF 9000AG