BERGQUIST® SIL PAD® TSP 1600

BERGQUIST® SIL PAD TSP 1600 is specifically formulated to provide excellent thermal performance for discrete semiconductor applications that use low clamping pressures (e.g., spring clips at 10 to 50 psi.). In contrast, if you are designing for higher clamping pressure applications using discrete semi-conductors (e.g., 50 to 100 psi.), it is likely that you will prefer the combination of high thermal performance and cut-through resistance inherent in BERGQUIST® SIL PAD TSP 1600S material.

Each application has specific characteristics (e.g., surface finish, flatness tolerances, high pressure requirements, potential burrs, etc.) that determine which SIL PAD product will optimize thermal performance. Select a minimum of two pads that best fit the application, then conduct testing to determine which material performs the best.

The ISO certification is the adoption of a quality management system that is a strategic decision of the organization. This International Standard specifies requirements for a quality management system where an organization: a) needs to demonstrate its ability to consistently provide product that meets customer and applicable regulatory requirements, and b) aims to enhance customer satisfaction through the effective application of the system, including processes for continual improvement of the system and the assurance of conformity to customer and regulatory requirements.