LOCTITE® ECCOBOND FP4323
Features and Benefits
LOCTITE ECCOBOND FP4323, Epoxy, Encapsulant - glob top
LOCTITE® ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. It is designed with flow capabilities that allows encapsulation without flowing beyond the chip.
- Low CTE for improved thermal cycling
- Thixotropic
- High purity
- Excellent moisture resistance
Documents and Downloads
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LOCTITE® ECCOBOND FP4323
LOCTITE ECCOBOND FP4323, Epoxy, Encapsulant - glob top