LOCTITE® ABLESTIK 8601S25
Features and Benefits
LOCTITE ABLESTIK 8601S25, Epoxy, Die Attach
LOCTITE® ABLESTIK 8601S25 die attach adhesive has been formulated for use in high throughput die attach applications
- Snap curable
- Low outgassing
- Conductive
- Medium modulus
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Cure type | Heat cure |
| Thixotropic index | 5.6 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 7200.0 mPa·s (cP) |
LOCTITE® ABLESTIK 8601S25
LOCTITE ABLESTIK 8601S25, Epoxy, Die Attach