GAP PAD^®:  Powerhouse Thermal Control for Datacom and Telecom Applications

Versatile GAP PAD^® Technology for Telecom and
Datacom Thermal Control

Greater network bandwidth and data processing, Wi-Fi 6 enterprise systems and 5G infrastructure devices require higher power ICs and larger CPUs within high-density electronic designs.   These factors, combined with the expectations for constant operation and fluctuating peak demand, result in increased heat generation which, if not properly controlled, can significantly reduce performance and efficiency. 

Thermal management is essential if modern data and telecom systems are to deliver optimal performance.  While there are many elements that contribute to a robust thermal design strategy, trusted thermal gap pads^® are often employed for a variety of reasons, not the least of which is the various stack up tolerances within these systems.  

Download to listen Henkel thermal management subject matter expert, Blake Wageman, for a webinar to learn more about design trends in the telecom/datacom market space, the factors driving increased heat generation and the applications where pad-based thermal materials offer a high degree of success. 

Webinar Highlights:

• Trends in telecom/datacom systems that are driving increased power densities and operational heat
• The basics of thermal interface materials (TIM): function, key properties and selection criteria
• GAP PAD^® technology 
• Application testing and determination of in-use thermal management effectiveness

Presenter and Subject Matter Expert

Blake M. Wageman
Applications Engineer  
Expert in thermal management solutions for the Telecom and
Cloud Hyperscale data Center

Register to Download