Why Bonding Matters in
Electric Motor Assembly?

Henkel Provides Reliable Thermal, Protecting & Bonding Solutions

Reliable Thermal, Protecting, & Bonding Solutions for Power Conversion Applications

Industry 4.0 (I4.0) has been a significant megatrend in the manufacturing world for over a decade. It has revolutionized modern-day manufacturing, bringing unprecedented efficiency and benefits such as reduced operational costs, improved output, sustainable production, data-driven quality control, and high-efficiency manufacturing. However, challenges such as data security concerns, lack of an IT-adept workforce, and inefficient integration of new systems remain hurdles to easy and widespread adoption. The pandemic has demonstrated the advantages of advanced automation, and investments in I4.0 have paid dividends. This article explores how materials can optimize the performance and reliability of electronics and complex mechanical systems, prolonging robust system performance to derive maximum benefit from I4.0.

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What is innovation? In today’s competitive landscape, innovation must move beyond just being new to being something consequentially transformative.

Silicone-based chemistry formulations are used throughout electronic applications, and for good reason.

Customer Challenges

• A new Programmable Logic Controller (PLC) design required a robust thermal management solution with no outgassing risk.
• As the system can be used in a variety of machines and production environments, the thermal materials must be conducive to many conditions.
• The customer requested the use of a silicone-free thermal solution to avoid silicone contamination, but wanted to maintain the stress control and heat benefits generally consistent with silicone-based thermal interface materials (TIMs).

Customer Challenges

• A new electronic control unit (ECU) design incorporates a large processor IC that requires excellent heat dissipation for optimized function. 
• The system is sensitive and outgassing minimization is necessary to avoid interference with other components.