LOCTITE® ABLESTIK C860-1J

Known as ECCOBOND C-860-1J

Features and Benefits

TDS Download
LOCTITE ABLESTIK C860-1J, Epoxy, Assembly
LOCTITE® ABLESTIK C860-1J silver filled epoxy adhesive is specially suited for die and component bonding in microelectronic applications.
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Documents and Downloads

Technical Data Sheet
LOCTITE® ABLESTIK C860-1J
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