Products

Epoxy-based, composite surfacing film for lightning strike protection

Reactive hotmelt adhesive system for lamination and general assembly work 

One-part, heat-resistant epoxy adhesive

Two-part, thermally conductive epoxy encapsulant

Polyamide hotmelt for low-pressure molding applications 

Low viscosity, low abrasion, general-purpose filled encapsulant  

Thermally conductive, 2-part epoxy encapsulant

Clear, flexible silicone compound

Curing agent/hardener for use with potting and encapsulating resins

Low-viscosity, urethane potting compound

No-flow encapsulant designed for local circuit board protection 

Polyurethane resin for range of hardeners