TECHNOMELT® PA 2302 BLACK
Features and Benefits
This 1-part, low viscosity, thermoplastic hot melt adhesive is specially designed for molding applications.
TECHNOMELT® PA 2302 BLACK is a 1-part polyamide hot melt adhesive formulated for molding processes. Its low viscosity makes it ideal for encapsulating fragile components without damage. Once applied, it solidifies to form a barrier between electronics and the environment. Ideal for potting electronics modules, molding strain relief into wiring, and encapsulation of sensors. A versatile adhesive for a variety of substrates.
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Technical Information
| Applications | Encapsulating |
| Colour | Black |
| Number of components | 1 part |
TECHNOMELT® PA 2302 BLACK
This 1-part, low viscosity, thermoplastic hot melt adhesive is specially designed for molding applications.