BERGQUIST® HI FLOW THF 3000UT
Відомий як Hi-Flow® 565UT
Особливості та переваги
A naturally tacky, unreinforced thermally conductive phase change material designed for electronic power devices such as a processor lid or die to a heat sink. No spill, no mess, high reliability.
BERGQUIST® HI FLOW THF 3000UT is a thermally conductive 52°C phase change material that comes in a tabulated pad form for ease of assembly. This product is designed with a phase change softening feature for improved handling prior to assembly. Very low thermal impedance is produced by wetting out the thermal interfaces at application temperatures and pressures. BERGQUIST HI FLOW THF 3000UT is comparable to the best thermal greases and the consistent thickness ensures reliable performance without pump-out often experienced with some thermal greases. Can be applied using low pressure roller or manual applications. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Технічна інформація
| Колір | Синій |
| Стандартна товщина | 0.127 - 0.254 мм |
| Стійкість до полум’я | V-0 |
| Температура застосування | 125.0 °C |
| Теплопровідність | 3.0 W/mK |
BERGQUIST® HI FLOW THF 3000UT
A naturally tacky, unreinforced thermally conductive phase change material designed for electronic power devices such as a processor lid or die to a heat sink. No spill, no mess, high reliability.