Printed Electronics ThINK Together Events Welcome to the Henkel Printed Electronics ThINK Together Event Page – A showcase for our digital events, offering first-hand insights on latest material innovations for stretchable, flexible & high-speed printable electronics, material processing advice to improve your screen printability recommendations for innovative material solutions to create seamlessly connected sensing applications within the field of healthcare, hygiene and consumer surfaces Grab a coffee and listen into our latest video podcasts. Read More
Low Pressure Molding Solutions Many electronic assemblies are exposed to extreme conditions, such as strong temperature swings, corrosive environmental media or high humidity. Nevertheless, these devices have to deliver the expected performance, despite difficult environmental conditions. While Henkel has various solutions in its portfolio for electronic component and assembly protection, one in particular is a special hotmelt used in the low pressure molding process. These innovative hotmelts, which Henkel markets under the TECHNOMELT® brand, have a broad range of uses and are now available for almost every application. With the low pressure molding process, it is possible not only to bond surfaces but also to provide protective encapsulation, even for small and delicate electronic components. Thanks to the use of renewable raw materials, hotmelts are more environmentally compatible than other products and are RoHS and WEEE-approved materials. Once the hotmelts are in direct contact ... Read More
EMI Shielding Solutions for Semiconductor Packages With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference (EMI). Radio-frequency (RF) emitting devices require effective isolation to limit the propagation of their interference to neighboring components to protect the end device from performance degradation. As electronics move toward miniaturization, lighter weight, and higher speeds, these challenges become more significant as conventional shielding methods present functional and operational limitations. To address this, the Faraday cage is applied directly at the package level. This webinar will cover Henkel’s latest materials, application process, test methods, and performance. Authors: Jinu Choi, Xinpei Cao, Dan Maslyk Read More
Safe, Silent & Efficient - Webinar on Vehicle Design with Next Generation Structural Reinforcement Solutions Learn how Henkel Structural Inserts can lead to significant weight savings and cost reduction for vehicle structural components. Read More
Web-Seminar on Next Generation Structural Adhesives Learn more about Henkel's optimized material solutions for next generation automotive structural bonding Read More
Smart Card Market Trends and Integrated Adhesive Solutions The increased adoption of Smart Cards has largely been driven by the global acceptance of the EMV standard for efficient banking and payment infrastructure implementations, along with higher capacity requirements in telecommunications and secure administrative processes for personal identification and access control. Smart Cards, however, are only as good as the reliability provided by the materials that enable their production. Selecting the most effective adhesive solutions that exceed stringent manufacturing and end-use requirement is essential. This webinar will present information about Smart Card market trends, future growth drivers and details on materials that provide essential Smart Card quality and reliability. Jinu Choi is a Market Development Manager at Henkel Electronic Materials responsible for global product strategy and business development of advanced materials. Author: Jinu Choi Read More
Webinar on Next Generation Metal Pretreatment Learn more about advancing sustainability & cost efficiency with Next Generation Metal Pretreatment Read More
Livestream on Body & Paint Shop Material Solutions for Next Generation Vehicles On Oct 13, join Henkel to learn how material solutions are enabling a no compromise approach to next generation vehicle design and manufacturing. Read More
Web-Seminar on New Fast-Dispensable 7 W/mK Liquid Gap Filler New high-performance liquid Gap Filler with 7 W/mK suitable for mass production Read More