LOCTITE® ECCOBOND FP4526
Features and Benefits
This low-viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip-chip applications.
LOCTITE® ECCOBOND FP4526 is a heat-curable 63%-filled underfill designed for capillary flow on flip chip applications. Its fast flow and low viscosity, along with its excellent wettability and adhesion, make it ideal for high-reliability applications. It can be used on ceramic, organic, solder mask and polyimide substrates, but is perfect for ceramic packages and FC on flex applications.
- Excellent wettability
- Excellent adhesion
- Low viscosity
- Fast flow
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 101.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 33.0 ppm/°C |
| Cure schedule, @ 165.0 °C | 15.0 min. |
| Flexural modulus | 8500.0 N/mm² (1232500.0 psi ) |
| Glass transition temperature (Tg) | 133.0 °C |
| Viscosity, Brookfield Cone & Plate, @ 25.0 °C Spindle 52, speed 10 rpm | 4700.0 mPa·s (cP) |
LOCTITE® ECCOBOND FP4526
This low-viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip-chip applications.