LOCTITE® ABLESTIK 517
Features and Benefits
LOCTITE ABLESTIK 517, Epoxy Film, Assembly
LOCTITE® ABLESTIK 517 epoxy film adhesive is developed for microelectronic applications. This adhesive is not recommended for gold plated packages.
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Technical Information
| Adhesive film thickness | 3.0 µm |
| Carrier film thickness | 1.0 mil |
| Carrier type | Glass fabric |
| Cure schedule, @ 150.0 °C | 30.0 min |
| Cure type | Heat cure |
| Dielectric constant, @ 1kHz | 4.3 |
| Glass transition temperature (Tg) | 101.0 °C |
| Physical form | Film |
| Shear strength, Aluminium | 2500.0 psi |
| Thermal conductivity | 0.28 W/mK |
LOCTITE® ABLESTIK 517
LOCTITE ABLESTIK 517, Epoxy Film, Assembly