LOCTITE® ABLESTIK ATB F125E

Features and Benefits

LOCTITE ABLESTIK ATB F125E adhesive film is formulated for use in wafer lamination processes or as a preform decal.
LOCTITE® ABLESTIK ATB F125E adhesive film is formulated for use in wafer lamination processes or as a preform decal.
Read More

Technical Information

Adhesive film thickness 25.0 µm
Application method Lamination
Applications Die attach
Carrier type Polyolefin
Colour White
Cure type Heat cure, UV cure
Dicing tape diameter 12.0
Extractable ionic content, Chloride (CI-) 19.0 ppm
Extractable ionic content, Potassium (K+) 1.0 ppm
Extractable ionic content, Sodium (Na+) 2.0 ppm
Hot die shear strength, @ 260.0 °C 2.5 x 2.5 mm Si die on BT substrate 3.1 kg-f
Key characteristics Work life: long work life
Moisture absorption 0.78 %
Physical form Film
Recommended for use with Laminate
Tensile modulus, @ 250.0 °C 185.0 N/mm² (26831.0 psi )
Wafer diameter 12.0
Weight loss, TGA @ 200.0 °C 0.27 %