Thermal Interface Materials - Novel Solutions for Power Electronics and Heat Management in Handheld Devices As power electronic devices become more and more prevalent in different markets, the need for new materials to enable higher performance — while maintaining reliability — is gaining higher focus. The management of heat for these upcoming applications requires new designs and technologies. Author: Giuseppe Caramella Read More
High Efficient LED Light Cure Automatic Assembly Solution Are you looking for an automatic solution for LED light cure assembly? Join our Masterclass to improve your efficiency. Read More
Battery Engineering Center Accelerating innovation in battery technology by integrating material application, battery system testing, digital simulation, and product development Read More
Henkel E-Mobility Solutions Discover Henkel’s innovations and material solutions for Electric Vehicles Read More
Power Conversion Systems Key challenges and solutions for EV power electronics and conversion systems Read More
EMI Shielding Solutions for Semiconductor Packages With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference (EMI). Radio-frequency (RF) emitting devices require effective isolation to limit the propagation of their interference to neighboring components to protect the end device from performance degradation. As electronics move toward miniaturization, lighter weight, and higher speeds, these challenges become more significant as conventional shielding methods present functional and operational limitations. To address this, the Faraday cage is applied directly at the package level. This webinar will cover Henkel’s latest materials, application process, test methods, and performance. Authors: Jinu Choi, Xinpei Cao, Dan Maslyk Read More
Smart Card Market Trends and Integrated Adhesive Solutions The increased adoption of Smart Cards has largely been driven by the global acceptance of the EMV standard for efficient banking and payment infrastructure implementations, along with higher capacity requirements in telecommunications and secure administrative processes for personal identification and access control. Smart Cards, however, are only as good as the reliability provided by the materials that enable their production. Selecting the most effective adhesive solutions that exceed stringent manufacturing and end-use requirement is essential. This webinar will present information about Smart Card market trends, future growth drivers and details on materials that provide essential Smart Card quality and reliability. Jinu Choi is a Market Development Manager at Henkel Electronic Materials responsible for global product strategy and business development of advanced materials. Author: Jinu Choi Read More
Henkel Dual Cure Adhesives Enables Camera Module Success The camera module industry is the focus of much attention, as the addition of camera features into mobile devices — and now into the automotive segment — is driving manufacturers to develop camera technologies that capitalize on this sector’s growth. The more advanced the camera modules become, particularly as pixels and lens quantity increase, a different technique called ‘Active Alignment’ is employed, which requires dual-cure adhesives with UV and thermal cure capabilities to bond the lens holder to the substrate. Read More