Thermal Solutions for 5G & Wi-Fi 6 Technologies

Digital transformation has been a focus for today’s enterprise for some time, but the pandemic has rapidly escalated the need for both innovation and business transformation. Two key areas we are seeing this significant shift is in the emergence of next generation wireless connectivity technologies Wi-Fi 6 and 5G.

Digital transformation is accelerated by the next generation wireless connectivity technologies 5G and Wi-Fi 6. Both technologies  complement one another to offer seamless mobility and enhanced performance through providing higher bandwidth connections & broadband data access. With higher power densities, thermal control is a critical element in ensuring the high reliability and consistent performance of 5G infrastructure devices, cloud datacenter electronics and Wi-Fi 6 space. This presentation focus on introducing the innovative thermal material solutions Henkel developed to meet the environmental and positioning demands of these applications.

The pandemic has also accelerated the deployment of Wi-Fi 6 in the enterprise and dramatically affected usage across global networks. As a result, the pressure to invest in these next generation technologies is increasing, to ensure both current and future demands will be met. 

Thermal Gels from Henkel

As the 5G wireless broadband connection standard continues to gain traction, development and deployment of next-generation systems that can reliably manage high volumes of mobile data processing and transfer are accelerating.  Working to help telecom device designers achieve critical in-field robustness and reliability, Henkel has a new gel thermal interface material (TIM) that can withstand the environmental and positioning demands of today’s infrastructure components.

Enabling the advances of tomorrow

Henkel partners SMTA Penang Chapter

Henkel is pleased to announce that we are the SMTA Penang Chapter 2021 sponsor this year for - Explore The Hidden Interest.  In this event, Henkel, as the pioneer in adhesives technology, will deliver and showcase our insights on how innovative adhesive technology helps accelerate the next generation wireless connectivity technologies 5G and Wi-Fi 6.

SMTA Penang Chapter

SMTA is an international association for electronics engineering and manufacturing professionals. SMTA offers exclusive access to local, regional, domestic and global communities of experts, as well as accumulated research and training materials from thousands of companies dedicated to advancing the electronics industry. SMTA currently is comprised of 55 regional chapters around the world and 29 local vendor exhibitions (worldwide), 10 technical conferences (worldwide), and one large annual meeting.

SMTA's mission of sharing knowledge and best processes by bringing educational content and a global network to local regions. It's a wonderful opportunity for young students and young professionals to connect to their field domain and potential recruiters.

Henkel key speaker

At Henkel, we have always worked closely with our customers and partners to drive innovation, including at the forefront of smarter technologies for smarter nations. Henkel solutions will empower businesses to “smart-up” their offerings, delivering high-performance through our trusted.

Hear the Expert

Ms. Yeo Chun Hui
Technical Customer Service Manager, South East Asia

Chun Hui joined Henkel in 2020 as SEA Technical Manager in the Adhesive Technology Industrial team. She leads the SEA technical team to provide innovative technical solutions for customers in multiple markets such as Data & Telecom, Power & Industrial Automation, Medical and Industrial Core. Based in Singapore, Chun Hui holds a Bachelor of Science in Chemistry (2nd Class Upper Honours) from the National University of Singapore.

Presentation Topic: Henkel Thermal Solutions for 5G & Wi-Fi 6 Technologies

How can I participate?

The Virtual event will be hold on both 20th and 21st October 2021.  The techday will gather industry leaders to share their vision, technology roadmaps and discuss ways to deliver on the promise of this groundbreaking technology across the entire semiconductor value chain.  To participate, kindly fill in your details the techy webform below.

Event Details
Date/Time:
20th & 21st October | 08:30 – 17:00 (GMT+8)

Henkel Key Speaker
Key Topic:
Henkel Thermal Solutions for 5G & Wi-Fi 6 Technologies
Key Speaker: Ms. Yeo Chun Hui

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