Enabling the Electronics Technologies of Today, for the Advances of Tomorrow

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In today's digitized world, continuous innovation depends on the development of smaller, faster, and more reliable devices, especially in applications such as high-performance computing (HPC)/data centers, communication networks, electrified cars, and consumer electronics.

This pursuit has been the cornerstone for semiconductor companies as they push the boundaries of miniaturization and increasingly complex integration. If this is your reality and you seek ways to enable your out-of-the-box designs, we need to talk. You have questions, we have answers.

Come to the Henkel booth at the 18^th Philippines Semiconductor & Electronics Convention and Exhibition (PSECE).

Date: October 25 – 27, 2023

Time: 8 am - 17 pm

Venue: World Trade Center – Manila (Google Map)

Booth: #65 - 68

Here's what you can expect:

Exclusive insights into material innovations for today’s most advanced semiconductor devices – automotive grade reliability, advanced packaging innovations, and high thermal die attach formulations.
Networking opportunities with experts and peers in the industry
One-on-one consultations with Henkel technical experts
And do not miss our booth activities, attractive gifts and the chance to rest with refreshments and a cup of coffee

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If you wish to have a one-to-one meeting at the event, we kindly request you reserve a spot. Please select only one option:

Oct 25 morning

Oct 25 afternoon

Oct 26 morning

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No 1:1 meeting, I will just stop by.

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We will contact you close to the date to confirm your appointment.

Drop us a note (neil-gielenne.dequito@henkel.com) to amend your preference or if you have any questions.

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