LOCTITE® ABLESTIK ABP 2030SCR

Features and Benefits

LOCTITE ABLESTIK ABP 2030SCR, Proprietary Hybrid Chemistry, Die Attach, Conductive Adhesive
LOCTITE® ABLESTIK ABP 2030SCR conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes.
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Technical Information

Applications Die attach
Cure type Heat cure
Thermal conductivity 2.0 W/mK
Thixotropic index 5.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 15000.0 mPa·s (cP)