LOCTITE® ABLESTIK ATB 110U
Known as EASY STACK ATB-110U, 12-INCH
Features and Benefits
LOCTITE ABLESTIK ATB 110U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability.
LOCTITE® ABLESTIK ATB 110U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability.
- Fast cure
- Non-conductive
- Thin bondline
- Excellent gap filling ability
Documents and Downloads
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Technical Information
| Adhesive film thickness | 10.0 µm |
| Carrier film thickness | 85.0 µm |
| Dicing tape diameter | 12.0 |
| Extractable ionic content, Chloride (CI-) | 10.0 ppm |
| Extractable ionic content, Fluoride (F-) | 10.0 ppm |
| Extractable ionic content, Potassium (K+) | 10.0 ppm |
| Extractable ionic content, Sodium (Na+) | 10.0 ppm |
| Hot die shear strength | 2.0 kg-f |
| RT die shear strength | 40.0 kg-f |
| Tensile modulus, DMTA @ 250.0 °C | 2.0 N/mm² (230.0 psi ) |
| Wafer diameter | 12.0 |
| Weight loss, @ 300.0 °C | <1.0 % |
LOCTITE® ABLESTIK ATB 110U
LOCTITE ABLESTIK ATB 110U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability.