LOCTITE® ABLESTIK CDF 600

Features and Benefits

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LOCTITE® ABLESTIK CDF 600 silver filled, die attach adhesive is recommended for large die applications. It is suitable for bonding integrated circuits and components onto laminate substrates.
  • Low warpage
  • Consistent bondline control with minimal die tilt
  • Pre-cut wafer lamination equipment compatible
  • Recommended for thin wafer handling applications
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Documents and Downloads

Technical Data Sheet
LOCTITE® ABLESTIK CDF 600
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