LOCTITE ECCOBOND UF 3513HF

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LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant
LOCTITE® ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical and moisture resistant properties for protection of electronic components.
  • Halogen-free
  • One component for easy processing
  • Fast cure at moderate temperatures
  • Good adhesion to a variety of substrates
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Informasi Teknis

Jadwal Pengerasan, @ 80.0 °C 30.0 min.
Koefisien Muai Termal (CTE), Above Tg 197.7 ppm/°C
Koefisien Muai Termal (CTE), Below Tg 60.4 ppm/°C
Suhu Penyimpanan 2.0 - 8.0 °C
Suhu Transisi Kaca (Tg) 75.0 °C
Teknologi Epoxy
Tipe Pengeringan Heat Cure
Viskositas, Brookfield CP51, @ 25.0 °C Speed 20 rpm 3300.0 mPa.s (cP)
Waktu Masa Campur 3.0 day