LOCTITE ECCOBOND FP4531
fitur dan keuntungan
LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap.
LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap.
- Snap curable
- Fast flow
- Passes NASA outgassing
Dokumen dan Unduhan
Mencari TDS atau SDS dalam bahasa lain?
Informasi Teknis
| Modulus Lendut | 7600.0 N/mm² (1102000.0 psi ) |
LOCTITE ECCOBOND FP4531
LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap.