LOCTITE ECCOBOND FP4530SF

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LOCTITE ECCOBOND FP4530SF, Snap curable, Silane-free, Epoxy, Underfill
LOCTITE® ECCOBOND FP4530SF underfill is designed for flip chip on flex applications with a 25 micron gap. This material is formulated to change color from blue to green during the cure process to indicate the cure status. LOCTITE ECCOBOND FP4530SF is the silane-free version of LOCTITE ECCOBOND FP4530.
  • Snap curable
  • Compatible with small gap sizes
  • Fast flow
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Dokumen dan Unduhan

Teknis Lembar Data
LOCTITE ECCOBOND FP4530SF
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Informasi Teknis

Aplikasi Kurang Pengisian
Jadwal Pengerasan, @ 160.0 °C 8.0 min.
Kekentalan, Cone & Plate Brookfield, @ 25.0 °C Spindle 52, speed 20 rpm 3300.0 mPa.s (cP)
Koefisien Muai Termal (CTE), Above Tg 150.0 ppm/°C
Koefisien Muai Termal (CTE), Below Tg 45.0 ppm/°C
Suhu Penyimpanan -40.0 °C
Suhu Transisi Kaca (Tg) 145.0 °C
Teknologi Epoxy
Tipe Pengeringan Heat Cure
Waktu Masa Campur 24.0 hr.
Warna Biru