BERGQUIST LIQUI BOND TLB EA1800

Terkenal sebagai Liqui-Bond® EA 1805

fitur dan keuntungan

BERGQUIST LIQUI BOND TLB EA1800 is a silicone free, epoxy based, liquid-dispensable adhesive which creates a high strength bond.
BERGQUIST® LIQUI BOND TLB EA1800 is a two component, silicone-free, thermally conductive epoxy liquid adhesive. It can be cured at room temperature and exhibits excellent chemical and mechanical stability. The product creates a high bond strength which eliminates the need for fasteners and maintains structural bond even in severe environments. It is ideal for use in filling any surface irregularities between heat sources and heat sinks of similar coefficient of thermal expansion.
  • Thermal conductivity: 1.8 W/m-K
  • High bond strength, room temperature cure
  • UL94 V-0 compliance
  • Silicone-free
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Informasi Teknis

Konduktivitas Termal 1.8 W/mK
Suhu Operasi -40.0 - 125.0 °C
Teknologi Silikon
Tingkat Nyala Api V-0
Resin
Warna, Resin Abu-abu
Pengeras
Warna, Pengeras Kuning: Kuning Terang