BERGQUIST GAP FILLER TGF 2000
Terkenal sebagai Gap Filler 2000
fitur dan keuntungan
BERGQUIST GAP FILLER TGF 2000 is a silicone-based, thermally conductive and form-in-place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 2000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
- Ultra-conforming, designed for fragile and low-stress applications
- Thermal conductivity: 2.0 W/m-K
- 100% Solids – no cure by-products
- Ambient and accelerated cure schedules
Dokumen dan Unduhan
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Informasi Teknis
Kapasitas Panas, ASTM E1269 | 1.0 J/g-K |
Kekerasan Shore, Thirty second delay value, ASTM D2240 Shore 00 | 70.0 |
Konduktivitas Termal | 2.0 W/mK |
Konstanta Dielektrik, @ 1kHz | 7.0 |
Massa Jenis | 2.9 g/cm³ |
Rasio Campuran, menurut Berat | 1 : 1 |
Rasio Campuran, menurut Volume | 1 : 1 |
Resistivitas Volume | 1×10 Ohm m |
Suhu Penyimpanan | 25.0 °C |
Tingkat Nyala Api | V-0 |
Umur Simpan | 6.0 mon. |
Resin | |
Warna, Resin | Merah: Pink |
Pengeras | |
Warna, Pengeras | Putih |