BERGQUIST GAP FILLER TGF 2000

Terkenal sebagai Gap Filler 2000

fitur dan keuntungan

BERGQUIST GAP FILLER TGF 2000 is a silicone-based, thermally conductive and form-in-place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 2000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
  • Ultra-conforming, designed for fragile and low-stress applications
  • Thermal conductivity: 2.0 W/m-K
  • 100% Solids – no cure by-products
  • Ambient and accelerated cure schedules
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Informasi Teknis

Kapasitas Panas, ASTM E1269 1.0 J/g-K
Kekerasan Shore, Thirty second delay value, ASTM D2240 Shore 00 70.0
Konduktivitas Termal 2.0 W/mK
Konstanta Dielektrik, @ 1kHz 7.0
Massa Jenis 2.9 g/cm³
Rasio Campuran, menurut Berat 1 : 1
Rasio Campuran, menurut Volume 1 : 1
Resistivitas Volume 1×10 Ohm m
Suhu Penyimpanan 25.0 °C
Tingkat Nyala Api V-0
Umur Simpan 6.0 mon.
Resin
Warna, Resin Merah: Pink
Pengeras
Warna, Pengeras Putih

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