BERGQUIST GAP FILLER TGF 1500LVO

Terkenal sebagai Gap Filler 1500LV

fitur dan keuntungan

BERGQUIST GAP FILLER TGF 1500LVO is low outgassing, silicone based, liquid gap filler compatible for use with silicone-sensitive electronics.
BERGQUIST® GAP FILLER TGF 1500LVO is a two part, thermally conductive liquid gap filler that offers high temperature resistance and is proven to have significantly lower levels of silicone outgassing. BERGQUIST GAP FILLER TGF 1500LVO cures at room temperature or can be accelerated using heat and is ideal for applications that are fragile or do not require a strong bond due to a lower level of adhesion strength.
  • Low volatility for silicone sensitive applications
  • Thermal conductivity: 1.8 W/mK
  • Ultra-conforming, with excellent wet-out
  • 100% solids — no cure by-products
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Informasi Teknis

Konduktivitas Termal 1.8 W/mK
Teknologi Silikon
Tingkat Nyala Api V-0
Tipe Pengeringan Heat Cure
Resin
Warna, Resin Kuning
Campuran
Warna, Campuran Kuning
Pengeras
Warna, Pengeras Putih

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