BERGQUIST HI FLOW THF 700FT
Terkenal sebagai Hi-Flow® 225FT
fitur dan keuntungan
BERGQUIST HI FLOW THF 700FT, Reworkable, Pressure Sensitive Phase Change Material
BERGQUIST® HI FLOW THF 700FT reworkable thermal interface material provides a low thermal resistance path between hot components such as high performance processors and heat sinks. The material consists of a 55°C phase change compound bonded to one side of a conformable metal foil. This pressure sensitive material is easily applied to the heat sink and securely conforms to many mounting surfaces. Its compliant foil allows for easy release and reworking without leaving residue on CPU surfaces. Above the 55°C phase change temperature, BERGQUIST HI FLOW THF 700FT wets-out the heat sink interface and flows to produce exceptional thermal performance. The thixotropic design of BERGQUIST HI FLOW THF 700FT requires pressure of the assembly to cause displacement and/or flow.
- Reworkable pressure sensitive
- Thermal impedance: 0.10°C-in2 /W (@25 psi)
- Compliant foil allows easy release and rework
- Tabbed parts for easy application
Dokumen dan Unduhan
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Informasi Teknis
Jenis Karier | Aluminium |
Konduktivitas Termal | 0.7 W/mK |
Suhu Operasi | 120.0 °C |
Teknologi | Silikon |
Tingkat Nyala Api | V-0 |
Warna | Hitam |