BERGQUIST HI FLOW THF 1600P
Terkenal sebagai Hi-Flow® 300P
fitur dan keuntungan
BERGQUIST HI FLOW THF 1600P is an electrically insulating, thermally conductive, and polyimide reinforced adhesive with excellent voltage breakdown and thermal performance.
BERGQUIST® HI FLOW THF 1600P is a thermally conductive 55°C phase change material, coated with a thermally conductive polyimide film that provides high dielectric strength and cut-through resistance while achieving superior values in thermal performance and voltage breakdowns. The 55°C phase change temperature reduces issues caused by shipping and handling and the easy release liner provides excellent handling in high volume assemblies. This product is ideal for use as a thermal interface material between electronic power devices that require electrical isolation to the heat sink.
- Thermal impedance: 0.13°C-in2/W (@25 psi)
- Field-proven polyimide film
- Excellent cut-through resistance
- Excellent dielectric performance
Dokumen dan Unduhan
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Informasi Teknis
Jenis Karier | Polimida |
Ketebalan Standar | 0.102 - 0.127 mm |
Konduktivitas Termal | 1.6 W/mK |
Suhu Operasi | 150.0 °C |
Teknologi | Silikon |
Tingkat Nyala Api | V-0 |
Warna | Hijau |