BERGQUIST HI FLOW THF 1000U

Terkenal sebagai Hi-Flow® 225U

fitur dan keuntungan

BERGQUIST HI FLOW THF 1000U, Non-Reinforced Phase Change Thermal Interface Material
BERGQUIST® HI FLOW THF 1000U is designed for use as a thermal interface material between a computer processor and a heat sink. The product consists of a thermally conductive 55°C phase change compound coated on a release liner and supplied on a carrier. Above its phase change temperature, BERGQUIST HI FLOW THF 1000U wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The material requires pressure of the assembly to cause flow
  • Available in roll form with kiss-cut parts
  • Thermally conductive 55°C phase change compound
  • Hi-Flow® coating will resist dripping
  • Thermal impedance: 0.07ºC-in2 /W @ 25 psi
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Informasi Teknis

Ketebalan Standar 0.036 mm
Konduktivitas Termal 0.1 W/mK
Suhu Operasi 150.0 °C
Teknologi Silikon
Tingkat Nyala Api V-0
Warna Hitam

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