LOCTITE ABLESTIK 517
fitur dan keuntungan
LOCTITE ABLESTIK 517, Epoxy Film, Assembly
LOCTITE® ABLESTIK 517 epoxy film adhesive is developed for microelectronic applications. This adhesive is not recommended for gold plated packages.
- Non-conductive
- Tack-free
- Low temperature cure
Dokumen dan Unduhan
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Informasi Teknis
| Formulir Fisik | Film |
| Jadwal Pengerasan, @ 150.0 °C | 30.0 min. |
| Jenis Karier | Kain kaca |
| Kekuatan Geser, Aluminum | 2500.0 psi |
| Ketebalan Lem Lembaran | 3.0 µm |
| Ketebalan Lem Lembaran Karier | 1.0 mil |
| Konduktivitas Termal | 0.28 W/mK |
| Konstanta Dielektrik, @ 1kHz | 4.3 |
| Suhu Transisi Kaca (Tg) | 101.0 °C |
| Teknologi | Epoxy |
| Tipe Pengeringan | Heat Cure |
LOCTITE ABLESTIK 517
LOCTITE ABLESTIK 517, Epoxy Film, Assembly