LOCTITE ECCOBOND UF 3800

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LOCTITE ECCOBOND UF 3800, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
  • Reworkable
  • High Tg
  • Room temperature flow capability
  • Fast cure at moderate temperatures
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Dokumen dan Unduhan

Teknis Lembar Data
LOCTITE ECCOBOND UF 3800
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Informasi Teknis

Jadwal Pengerasan, @ 130.0 °C 8.0 min.
Koefisien Muai Termal (CTE), Above Tg 188.0 ppm/°C
Koefisien Muai Termal (CTE), Below Tg 52.0 ppm/°C
Suhu Transisi Kaca (Tg) 69.0 °C
Viskositas, Physica MCR100 @ 25.0 °C Spindle CP50-1 375.0 mPa.s (cP)