LOCTITE ECCOBOND EN 3839
fitur dan keuntungan
LOCTITE ECCOBOND EN 3839, Acrylic, Encapsulant, Glob top
LOCTITE® ECCOBOND EN 3839 is specially designed for encapsulating components on PCB applications. When cured, this material provides physical protection, as well as, protection in temperature/humidity/bias testing.
- Provides physical and electrical protection and stable electronic performance in temperature/humidity/bias testing
- UV/ heat curable
- Flexible, low Tg material for encapsulating components on a circuit board
- Thixotropic
Dokumen dan Unduhan
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Informasi Teknis
| Aplikasi | Enkapsulasi |
| Indeks Tiksotropik | 4.1 |
| Intensitas Cahaya Jadwal Pengerasan | 2000.0 mJ/cm² |
| Jadwal Pengerasan, @ 130.0 °C | 10.0 min. |
| Kekerasan Shore, Shore D | 27.0 |
| Koefisien Muai Termal (CTE), Above Tg | 211.0 ppm/°C |
| Koefisien Muai Termal (CTE), Below Tg | 108.0 ppm/°C |
| Modulus Penyimpanan, DMA @ 25.0 °C | 334.0 N/mm² (48400.0 psi ) |
| Suhu Penyimpanan | -20.0 °C |
| Suhu Transisi Kaca (Tg) | 26.0 °C |
| Teknologi | Acrylic |
| Tipe Pengeringan | UV Cure |
| Umur Simpan | 180.0 day |
| Viskositas, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 7800.0 mPa.s (cP) |
| Warna | Biru: Biru Muda |
LOCTITE ECCOBOND EN 3839
LOCTITE ECCOBOND EN 3839, Acrylic, Encapsulant, Glob top