LOCTITE ABLESTIK 3119
fitur dan keuntungan
LOCTITE ABLESTIK 3119, Epoxy, Bonding
LOCTITE® ABLESTIK 3119 cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive.
Please refer to the TDS for alternate cure schedules.
- One component - requires no mixing
- High speed curing at low temperature
- Excellent adhesion
Dokumen dan Unduhan
Mencari TDS atau SDS dalam bahasa lain?
Informasi Teknis
Suhu Transisi Kaca (Tg) | 110.0 °C |
Tipe Pengeringan | Heat Cure |