LOCTITE ABLESTIK QMI509

fitur dan keuntungan

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LOCTITE ABLESTIK QMI509, Bismaleimide Resin, Die Attach, Silver filled Conductive Adhesive
LOCTITE® ABLESTIK QMI509 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. This adhesive also exhibits a very low modulus, which can reduce inter-package stress. A package or device manufactured with LOCTITE ABLESTIK QMI509 will have good resistance to delamination and “popcorning” after exposure to reflow temperatures. LOCTITE ABLESTIK QMI509 can be cured in a conventional oven, on a snap cure oven, or utilize SkipCure™ processing on a die bonder or wire bonder.
  • Electrically conductive
  • Stable at high temperatures
  • Void-free bondline
  • Hydrophobic
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Dokumen dan Unduhan

Teknis Lembar Data
LOCTITE ABLESTIK QMI509
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Informasi Teknis

Aplikasi Pelekat Die
Indeks Tiksotropik 3.5
Koefisien Muai Termal (CTE) 77.0 ppm/°C
Koefisien Muai Termal (CTE), Above Tg 168.0 ppm/°C
Konduktivitas Termal 2.8 W/mK
Suhu Transisi Kaca (Tg) 1.0 °C
Tipe Pengeringan Heat Cure
Viskositas 8500.0 mPa.s (cP)