LOCTITE ABLESTIK C 990 333

fitur dan keuntungan

Unduh TDS
LOCTITE ABLESTIK C 990 333, Epoxy, Die attach
LOCTITE® ABLESTIK C 990 333 silver filled epoxy adhesive is specially suited for die and component bonding in microelectronic applications.
  • Silver-filled
  • Electrically conductive
  • Easily applied by stamping process
  • Low extractable ionics
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Dokumen dan Unduhan

Informasi Teknis

Aplikasi Pelekat Die
Nomor Komponen 1 Part
Suhu Penyimpanan -25.0 - -18.0 °C
Teknologi Epoxy
Tipe Pengeringan Heat Cure
Viskositas, @ 25.0 °C 24000.0 mPa.s (cP)