LOCTITE ABLESTIK ABP 8065T

fitur dan keuntungan

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LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
  • Medium to high thermal conductivity
  • No channel void issue
  • High die shear strength
  • High electrical conductivity
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Dokumen dan Unduhan

Teknis Lembar Data
LOCTITE ABLESTIK ABP 8065T
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Informasi Teknis

Aplikasi Pelekat Die
Indeks Tiksotropik 6.0
Koefisien Muai Termal (CTE) 40.0 ppm/°C
Koefisien Muai Termal (CTE), Above Tg 146.0 ppm/°C
Konduktivitas Termal 10.0 W/mK
Tipe Pengeringan Heat Cure
Viskositas, Brookfield CP51, @ 25.0 °C Speed 5 rpm 9000.0 mPa.s (cP)