LOCTITE ABLESTIK QMI546

fitur dan keuntungan

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LOCTITE ABLESTIK QMI546, BMI, Die attach
LOCTITE® ABLESTIK QMI546 die attach adhesive is formulated to cure rapidly below the boiling point of water, preventing steam from creating voids. This product is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives
  • Non-conductive
  • Stable at high temperatures
  • Hydrophobic
  • Void-free bondline
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Informasi Teknis

Aplikasi Pelekat Die
Indeks Tiksotropik 6.0
Koefisien Muai Termal (CTE), Above Tg 190.0 ppm/°C
Koefisien Muai Termal (CTE), Below Tg 80.0 ppm/°C
Konduktivitas Termal 0.2 W/mK
Suhu Transisi Kaca (Tg) 10.0 °C
Tipe Pengeringan Heat Cure
Viskositas 6500.0 mPa.s (cP)