LOCTITE ABLESTIK QMI536
fitur dan keuntungan
LOCTITE ABLESTIK QMI536, Bismaleimide Resin, Die Attach, Fluoropolymer Filled Non-conductive Adhesive
LOCTITE® ABLESTIK QMI536 is a Fluoropolymer filled non-conductive adhesive for attachment of integrated circuits and components to advanced substrates, including PBGAs, CSPs, array packages, and stacked die. This material is hydrophobic and stable at high temperatures. These features produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic and metal surfaces, including solder mask, BT, FR, polyimide, and Au. The adhesive also has excellent dielectric properties.
LOCTITE ABLESTIK QMI536 can be cured in a conventional oven, on a snap cure oven, or utilize Skip Cure processing on a die bonder or wire bonder. The material is formulated to produce cure onset below 100°C. This can reduce or eliminate the need to pre-dry organic substrates prior to the die attach process.
Please refer to the TDS for alternate cure times.
- One component - requires no mixing
- Stable at high temperatures
- Hydrophobic
- Excellent interfacial adhesive strength
Dokumen dan Unduhan
Mencari TDS atau SDS dalam bahasa lain?
Informasi Teknis
Aplikasi | Pelekat Die |
Formulir Fisik | Pasta |
Indeks Tiksotropik | 5.7 |
Kekuatan Geser Die RT, 7.6 x 7.6 mm Si die on Ag plated Cu leadframe | 17.0 kg-f |
Koefisien Muai Termal (CTE) | 98.0 ppm/°C |
Koefisien Muai Termal (CTE), Above Tg | 174.0 ppm/°C |
Konduktivitas Termal | 0.3 W/mK |
Konten Ionik yang Dapat Diekstrak, Fluor (F-) | 20.0 ppm |
Konten Ionik yang Dapat Diekstrak, Kalium (K+) | 20.0 ppm |
Konten Ionik yang Dapat Diekstrak, Klorida (Cl-) | 20.0 ppm |
Konten Ionik yang Dapat Diekstrak, Natrium (Na+) | 20.0 ppm |
Kunci Karakteristik | Adhesi: Adhesi yang Baik, Emisi Alpha: Emisi Alpha Ultra Rendah, Kecepatan Kering : Sangat Cepat, Dielectric, Dispensibility: Dispensibilitas yang Baik, Proses Bebas Timbal yang Sesuai, Modulus: Modulus rendah, Stres: Stres rendah |
Massa Jenis, Maximum Final | 1.3 g/cm³ |
Metode Aplikasi | Sistem dosis |
Modulus, DMA @ 25.0 °C | 0.3 GPa (300.0 N/mm² , 43500.0 psi ) |
Nomor Komponen | 1 Part |
Substrat | Laminasi, Polimida |
Suhu Transisi Kaca (Tg) | -31.0 °C |
Tipe Pengeringan | Heat Cure |
Viskositas | 8500.0 mPa.s (cP) |
Warna | Putih |