LOCTITE ABLESTIK ABP 8062T

Terkenal sebagai ABP-8062T (17.5g)

fitur dan keuntungan

Unduh TDS
LOCTITE ABLESTIK ABP 8062T, BMI Hybrid, Heat cure
LOCTITE® ABLESTIK ABP 8062T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity. LOCTITE ABLESTIK ABP 8062T highly filled die attach adhesive is suited for small to middle die sizes where thermal and electrical conductivity are needed in a high reliability package.
  • Hydrophobic
  • Thermally conductive
  • Electrically conductive
  • Stable at high temperatures
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Informasi Teknis

Aplikasi Pelekat Die
Koefisien Muai Termal (CTE) 100.0 ppm/°C
Tipe Pengeringan Heat Cure